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孙双双， 刘晓辉
（青岛科技大学 机电工程学院，山东 青岛 266061）
摘要: 在考虑Si基底膜对温度场影响的基础上，首先对形状记忆合金/硅复合膜工作时的温度场进行了理论建模，然后利用MATLAB软件对NiTi记忆合金/硅复合膜在一个完整的热循环过程中的温度响应特性进行了数值模拟与优化。研究发现，沿记忆合金/硅复合膜厚度方向，温度变化梯度非常小；Si基底膜考虑与否对记忆合金复合膜冷却段的温度场影响比较明显。此外，记忆合金复合膜加热段的温度响应特性受记忆合金相变潜热及加热功率的影响比较大；而其冷却段的温度响应特性受记忆合金相变潜热和工作时的流体介质影响比较显著。
关键词: 形状记忆合金/硅复合膜； 温度场建模； 温度响应分析
中图分类号: TB 381文献标志码：
Abstract:Temperature-response Characteristics of Shape Memory Alloy/Si Composite Films
SUN Shuang-shuang, LIU Xiao-hui
（College of Electromechanical Engineering, Qingdao University of Science and Technology, Qingdao 266061, China）
Abstract: On the basis of considering the effect of the Si substrate film, the temperature field of the shape memory alloy/Si composite film was modeled theoretically first, then the temperature response of NiTi-shape memory alloy/Si composite film was simulated and optimized by the MATLAB software in a complete thermal cycle. It was found that the temperature gradient was very small along the thickness of the shape memory alloy/Si composite film, and the Si substrate film had significant effects on the temperature response of the shape memory alloy/Si composite film during cooling. In addition, the temperature response of the shape memory alloy/Si composite film during heating was affected obviously by the phase-transformation latent heat of SMA and the heating power, while it was affected significantly by the phase-transformation latent heat of SMA and the fluid media during cooling.
Key words: shape memory alloy/Si composite film； temperature-field modeling； temperature-response analysis
收稿日期: 2010-12-17
基金项目: 山东省优秀中青年科学家科研奖励基金项目（BS2010CL016）;青岛科技大学博士基金项目（0022098）.
作者简介: 孙双双（1971—）,女，副教授.
